Chip on Glass modules are available in a variety of standard character and graphic sizes. They feature high contrast STN and FSTN technologies and are available with hot bar, ZIF and through hole connections allowing maximum flexibility during the assembly process. COG module technology is ideal for applications requiring a very thin package. Gold bump driver IC's are bonded directly to the glass edge eliminating the need for an additional PCB, bezel and connector.

• Standard modules available from 128 x 64 to 240 x 160
• FSTN technology
• White LED backlight
• 3V Drive - low power consumption
• Low profile, compact design
• Cost effective solution
• Fully customised solutions available

Typical applications include: POS units, DAB ,Radio, Bluetooth equipment.